SCIA, SCIAHK support ICCA Congress 2024 Held in Hong Kong

The XXVIth Congress of International Council for Commercial Arbitration (ICCA 2024) (hereafter referred to as “the congress”) was held in the Hong Kong SAR from May 5 to 8. This year’s congress attracted over 1,400 professionals from more than 70 jurisdictions, making it the largest session in the ICCA’s history.

 

The Shenzhen Court of International Arbitration (SCIA) and the South China International Arbitration Center (Hong Kong) (SCIAHK) supported and participated in the event as Diamond Sponsors, the highest level of sponsorship.

 

During the congress, SCIA and SCIAHK engaged in friendly exchanges with international arbitration experts from over 70 countries and regions, sharing the latest achievements in China’s international arbitration innovation and development.

 

Council Members of the SCIA and Board of Directors of the SCIAHK, including Prof. Shen Sibao, Anthony Neoh QC, SC, JP, Dr. Liu Xiaochun, Dr. Elsie Leung GBM, JP, Rimsky Yuen GBM, SC, JP, Kwai Huen Wong SBS, BBS, JP, Liu Chunhua, and Prof. Peter Malanczuk, attended the thematic seminars and side events of the ICCA Congress 2024.

 

Throughout the congress, legal groups from domestic and abroad visited the SCIAHK to learn about the latest developments in international arbitration and business environment under the “Shenzhen + Hong Kong” cross-jurisdictional synergy and innovation mechanism.

The venue of the ICCA Congress 2024 in Hong Kong

Participants pose for a group photo at the “Leveraging Legal Strengths for Business Growth Cocktail Reception” organized by the Department of Justice of the Hong Kong SAR government.

Legal groups from domestic and overseas visit the SCIAHK during the ICCA Congress 2024 in Hong Kong.